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Product Description
Texwipe TX750E is a mini, compressed CleanFoam® ESD-safe cleanroom swab designed for precision cleaning, controlled solvent application, and tight-geometry residue removal in electronics, microelectronics, semiconductor support, optics, and other static-sensitive controlled processes. The swab combines a 100 PPI polyurethane CleanFoam® compressed tip with a Stat-Rite® inherently dissipative handle to help reduce static-charge risk during point-of-use cleaning without relying on carbon-loaded materials that can shed or bloom. It is built with complete thermal bond construction (no adhesive) to reduce residue variables at the head/handle interface during solvent exposure. As with all swabs, performance is process-dependent and no swab is truly “lint-free” in every condition; the intent is low-linting cleaning that supports repeatable technique and consistent results.
Features- SKU: TX750E BAG
- Type: Dry swab (non-sterile)
- Swab family: CleanFoam
- Swab material: Foam
- ESD-safe: Yes (Stat-Rite® inherently dissipative handle)
- Head material: 100 PPI CleanFoam® polyurethane
- Head width: 3.5 mm (0.138")
- Head thickness: 3.5 mm (0.138")
- Head length: 10.0 mm (0.394")
- Handle material: Transplex (Stat-Rite® inherently dissipative polymer)
- Handle width: 3.0 mm (0.118")
- Handle thickness: 3.0 mm (0.118")
- Handle length: 78.5 mm (3.09")
- Total swab length: 88.5 mm (3.484")
- Head bond: Thermal (adhesive-free construction)
- Handle color: Translucent
- Design notes: Precision pointed tip; compact handle
- Packaging (bag): 500 swabs per bag (5 inner bags of 100 swabs)
- Packaging (case): 5 bags of 500 swabs per case
- Packaging controls: Packaged in an anti-static bag; lot coded for traceability and quality control
- Typical industries: Circuit Board Assembly, Display Assembly, Electronics Assembly, Hard Disk Drive, Medical Device, Microelectronics, Optics, Semiconductor, Test & Assembly
- Use environments: Commonly used across ISO-class cleanrooms and controlled areas (final suitability depends on your process, solvent system, ESD controls, and cleaning method)