Nasco

Devcon 14278 50Ml Devpak Epoxy Plus

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SKU SKU:kpi000-230-14278

$36.62 USD

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category: ADHESIVES SEALANTS & TAPES

manufacturer: Nasco

mpn: 230-14278

subcategory: ADHESIVE PRODUCTS

Product Description

Nasco - 230-14278

Manufacturer Part Number	14278
GTIN	078143142789
Family	Devcon 25 Epoxy Plus Adhesives
Manufacturer	Devcon
Manufacturer URL	http://www.devcon.com
Hazmat	Y
Testing and Approvals	Cured hardness tested according to ASTM D-2240; Chemical resistance was tested by immersion for 2 weeks at 42 C after 7 days cure at 75 F
Country of Origin	US
Features	25-minute working time Bonds metals, FRP composites, rigid plastics, concrete, glass, and wood Non-corrosive
Applicable Materials	Plastic; Most Metals; PVC; Aluminum; Steel; Ceramic
Applications	Multi-Purpose
Capacity Vol. [Nom]	50 mL
Chemical Compound	Epoxy
Color	Light Gray
Dielectric Strength	550 V/mil
Full Cure Time @ Temp.	24 h @ 75 F
Gap Fill [Nom]	0.08 in
Hardness [Nom]	74 Shore D
Packing Type	Dev-Pak
Resistance	Kerosene; Sulfuric Acid-10%; Toluene; Hydrochloric Acid
Temp. Range [Max]	200 F
Temp. Range [Min]	-40 F
Viscosity @ Temp. (Nom)	50,000 cP @ 77.0 F
Wt.	0.09 lb